 |
| Lugar de origem: | NC |
| Marca: | SIGNI |
| Certificação: | ISO |
| Número do modelo: | ss |
| Quantidade de ordem mínima: | 1pc |
|---|---|
| Detalhes da embalagem: | Caso de madeira |
| Tempo de entrega: | 15 dias |
| Termos de pagamento: | D/A, D/P, T/T, Western Union, MoneyGram |
| material: | Diamante | aplicação: | Safira |
|---|---|---|---|
| OEM: | Sim | Tamanho: | Conforme exigido |
| Realçar: | SiC Diamond Grinding Wheel,SAPPHIRE ISO Diamond Grinding Wheel,SiC cbn grinding wheel |
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Silicon Back Grinding Wheels Sapphire Epitaxial Wafer For Simiconductor Field
The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
This kind of grinding wheel developed in out company can replace foreign products. They can be used steadily on the Japanese, Korean grinders with high performance.
Workpiece processed: sapphire epitaxial wafer, SiC Substrate epitaxial wafer, Si Substrate epitaxial wafer.
Material of workpiece: Synthetic sapphire, SiC, single crystal silicon.
Grinders: SHUWA, NTS, WEC, GALAXY, SPEEDFAM.
Pessoa de Contato: Zhao
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