High Efficiency Synthetic Poly Diamond Powder For Pdc Drill Bit

High Efficiency Synthetic Poly Diamond Powder For Pdc Drill Bit

BRIEF DESCRIPTION Diamond Micro Powder

SIGNI synthetic diamond powder is made of the high-quality synthetic diamond as raw material, through many different and strict production processes. Our diamond powder can be processed and applied to the different industries for cutting, grinding, drilling and polishing usage, in order to match the different requirements.

Our polycrystalline diamond is produced by detonation with high energy explosive, the high explosive heat and high detonating pressure change the graphite into poly diamond, and its structure is similar to natural carbonado diamond. Because synthesis time is very short, there are some lattice defects inside the crystal, almost all the diamond particle is composed by integrating the micro crystallites size of less than 20nm together through sharing the crystal face. In processing special material, poly diamond will not scratch the workpiece’s surface, because its compressive strength and impact strength are far below common diamond products. Under certain pressure, microcrystal grain of poly diamond particle surface will continuously peel off and form new cutting edge. These characteristics provide solutions for grinding and polishing some high hardness special materials rapidly. Experiments show that the removal rate of poly diamond is 2~ 4 times higher than common diamond and without scratches. Based on years of mature experience of monocrystalline diamond powder, we have successfully resolved the technical processing issues of polycrystalline diamond, such as crushing, reshaping, purifying, grading etc.. We supply bulk polycrystalline diamond powder consistent with the standard requirements of the FDP series of monocrystalline diamond powder.

Available sizes

Remarks: Special requirements can be as per clients' requirement.

Product characteristics:

★ Round particle shape, no irregular shapes like pencils or flakes.

★ Oversizes completely removed.

★ Narrow PSD.

★ Surface purity can reach ppm level.

★ Outstanding dispersibility.

Application field:

Lapping and polishing of semiconductor wafers such as SiC and sapphire wafers.

Surface polishing of various ceramics.

Surface treatment of metals such as stainless steel and aluminium alloy.